Wire Wound(Ceramic)

• For high-frequency applications including mobile phones,portable phones, such as PA, ANT, VCO, SAW, etc.



• Mobile phones such as GSM, CDMA, PDC, etc.



• Bluetooth,W-LAN

 

Part Number	size (mm)	height (mm)	Inductance(nH)	Q	Rdc (Ω)		Irms (A)		SRF
HSC0603C	1.6 * 1.0	1.0	1.8~330	13~40	0.045~2.75		0.1~0.7		900~12500
HSC0805C	2.0 * 1.2	1.2	2.2~4700	10~65	0.05~15		0.09~0.8		40~7900
HQC0805C	2.0 * 1.2	1.2	2.5~180	55~98	0.03~0.6		0.6~1.6		900~6000
HEC1008C	2.5 * 2.0	1.8	4.2~10000	18~65	0.065~8.0		0.15~1.0		25~4300
HQC1008C	2.5 * 2.0	1.8	4.1~560	48~80	0.05~1.25		0.42~1.6		380~6000

*All specifications are subject to change without notice. Please contact our sales representatives for details.